Uyemura and eSurface Technologies Announce Strategic Partnership

Uyemura to Supply Chemistry and Technical Support to eSurface Licensees Worldwide

Uyemura International Corporation, a global leader in high-performance plating chemistry and solutions, and eSurface Technologies, the pioneer of the eSurface proprietary process for circuit formation, today announced a strategic partnership agreement. Under the terms of the agreement, Uyemura will become the preferred supplier of plating chemistry and technical support to eSurface licensees worldwide.

The eSurface process is a disruptive technology that enables creation of circuit patterns directly on the surface of injection molded plastic parts. By eliminating the need for a separate printed circuit board, the eSurface process enables significant cost savings, weight reduction, and design flexibility for electronics manufacturers.

“We are excited to partner with eSurface Technologies to support the growth and adoption of their innovative circuit technology,” said Tony Revier, President of Uyemura USA. “Uyemura’s world-class plating chemistry and technical expertise will ensure eSurface licensees have a reliable, scalable solution to bring their products to market quickly and cost-effectively.”

eSurface Leverages Uyemura’s Global Footprint and Plating Know-How

As the preferred chemistry supplier, Uyemura will work closely with eSurface and its licensees to develop and optimize plating processes for the eSurface technology. Uyemura brings over 50 years of experience in electroless and electrolytic plating, with a strong focus on the automotive, aerospace, medical, and consumer electronics markets.

“Uyemura’s global presence and proven track record in plating technology make them the ideal partner to support our licensing model,” said David Benson, CEO of eSurface Technologies. “By leveraging Uyemura’s expertise, our licensees can be confident they have a robust, production-ready plating process that meets the highest standards of quality and reliability.”

Under the agreement, Uyemura will provide its industry-leading plating chemistries, including electroless copper, electroless nickel, and Immersion Gold, to eSurface licensees. Uyemura will also provide on-site technical support and training to help licensees optimize their plating lines and troubleshoot any issues.

Benefits of the Uyemura-eSurface Partnership for Licensees

The partnership between Uyemura and eSurface Technologies brings significant benefits to eSurface licensees, including:

1. Access to proven, high-performance plating chemistries: Uyemura’s plating solutions are used by leading manufacturers worldwide and are known for their consistency, reliability, and performance.

2. Reduced development time and costs: By using Uyemura’s off-the-shelf chemistries and processes, licensees can avoid the time and expense of developing their own plating solutions.

3. Global technical support: Uyemura has a network of technical experts and support staff around the world, ensuring licensees have access to the knowledge and resources they need to be successful.

4. Scalability: Uyemura’s plating chemistries are designed for high-volume production, enabling licensees to scale their operations quickly and efficiently.

Comparison of Traditional PCB vs. eSurface Process

Factor	Traditional PCB	eSurface Process
Cost	High	Low
Weight	Heavy	Light
Design Flexibility	Limited	High
Environmental Impact	High	Low
Time to Market	Slow	Fast

As shown in the table above, the eSurface process offers several advantages over traditional printed circuit boards. By eliminating the need for a separate PCB, the eSurface process reduces cost, weight, and environmental impact while increasing design flexibility and reducing time to market.

Case Study: Automotive Manufacturer Adopts eSurface Technology

One of the first eSurface licensees to benefit from the Uyemura partnership is a major automotive manufacturer. The company was looking to reduce the weight and cost of its electronic components while improving design flexibility and time to market.

By adopting the eSurface process and using Uyemura’s plating chemistries, the manufacturer was able to:

• Reduce the weight of its electronic components by 50%
• Lower costs by 30% compared to traditional PCBs
• Improve design flexibility and integrate more functionality into each component
• Reduce development time by 6 months and get products to market faster

“The eSurface process and Uyemura’s plating solutions have been a game-changer for us,” said the manufacturer’s engineering manager. “We’ve been able to create lighter, more cost-effective components that are better suited to our design needs. And with Uyemura’s support, we were able to get up and running quickly without any major issues.”

The Future of Electronics Manufacturing with eSurface and Uyemura

The partnership between Uyemura and eSurface Technologies represents a significant step forward for the electronics manufacturing industry. By combining eSurface’s innovative circuit technology with Uyemura’s proven plating solutions, manufacturers can create lighter, more cost-effective, and more environmentally friendly products.

As more companies adopt the eSurface process and take advantage of Uyemura’s expertise, we can expect to see a wave of innovation in the electronics industry. From automotive components to consumer devices, the possibilities are endless.

“We believe the eSurface process has the potential to revolutionize electronics manufacturing,” said David Benson of eSurface Technologies. “And with Uyemura’s support, we’re confident that our licensees will be able to bring this technology to market quickly and successfully.”

Frequently Asked Questions (FAQ)

1. What is the eSurface process?
   The eSurface process is a proprietary technology that enables the creation of circuit patterns directly on the surface of injection molded plastic parts, eliminating the need for a separate printed circuit board.

2. How does the eSurface process differ from traditional PCB Manufacturing?
   Traditional PCB manufacturing involves creating a separate circuit board that is then attached to the electronic component. The eSurface process integrates the circuit directly into the surface of the component, reducing weight, cost, and environmental impact.

3. What are the benefits of using Uyemura’s plating chemistries with the eSurface process?
   Uyemura’s plating chemistries are proven, high-performance solutions that are used by leading manufacturers worldwide. By using Uyemura’s chemistries, eSurface licensees can reduce development time and costs, access global technical support, and achieve scalability for high-volume production.

4. What types of products can be manufactured using the eSurface process?
   The eSurface process can be used to manufacture a wide range of electronic components, including automotive parts, consumer devices, medical equipment, and more.

5. How can companies become eSurface licensees and take advantage of the Uyemura partnership?
   Companies interested in becoming eSurface licensees should contact eSurface Technologies directly. As part of the licensing agreement, licensees will have access to Uyemura’s plating chemistries and technical support.

In conclusion, the partnership between Uyemura and eSurface Technologies represents an exciting opportunity for electronics manufacturers to create lighter, more cost-effective, and more environmentally friendly products. By combining eSurface’s innovative circuit technology with Uyemura’s proven plating solutions, licensees can bring new products to market quickly and successfully, driving innovation and growth in the electronics industry.

RAYMING-PCB-manufacturing-and-asssembly.jpg” alt=”” class=”wp-image-136″ srcset=”” sizes=”(max-width: 1024px) 100vw, 1024px”>