Design around the material set
Tape thickness, conductor paste, via fill and firing behavior form a coordinated process. The supplier’s rules address via pitch, conductor registration, cavities and dimensional shrinkage. Start with those rules before adapting a conventional PCB stack-up.
Control shrinkage and registration
Unfired dimensions and final fired dimensions are different. The manufacturer compensates for shrinkage within a qualified process window. Define critical dimensions in the finished part and agree how alignment between layers, cavities and external attachments will be inspected.
Use integration where it creates value
Embedded routing and passive structures can reduce module size, but each added function increases the need for model correlation and test access. Plan probe pads and test coupons before enclosing internal structures. Thermal vias and package heat paths require their own assessment.
Engineering example
For an embedded filter, co-design the dielectric layers, printed conductors and external launches. Measure a representative coupon to correlate material and fabrication variation with the RF model.
Before you release the design
- Obtain the selected tape system’s design rules.
- Define all dimensions in the final fired state.
- Provide test access for embedded functions.
Sources and further technical reading
Manufacturer references support the material and process context. Worked examples and checklists are engineering guidance; they are not test results or supplier guarantees.