Design guides
Make every layer work together.
Practical design notes for the thermal path, copper pattern, insulation, attachment and qualification of ceramic circuits. Start with a controlled stack-up and measurable acceptance criteria.
How to select a ceramic PCB material
Start material selection with the problem the substrate must solve: thermal resistance, mechanical durability, electrical insulation or integration. Then shortlist compatible manufacturing routes.
Read the guide02 / Design guidesCeramic PCB thermal design: follow the heat path
A ceramic PCB is one part of a heat-transfer system. Add the resistance of the die, attachment layers, substrate, thermal interface and cooler before estimating device temperature.
Read the guide03 / Design guidesCeramic PCB stack-up specification
A ceramic stack-up should identify every functional layer, its finished thickness, its material and its manufacturing route. “Two-layer ceramic PCB” is not enough information to fabricate the part.
Read the guide04 / Design guidesCopper thickness on ceramic PCBs
Copper thickness affects electrical resistance, heat spreading, patterning and mechanical stress. Choose it with conductor width and manufacturing process rather than treating thicker copper as an automatic upgrade.
Read the guide05 / Design guidesTrace width and spacing on ceramic PCBs
Trace and space rules depend on process, conductor thickness and the definition of the finished profile. A minimum quoted without those conditions is not a usable design rule.
Read the guide06 / Design guidesVias and holes in ceramic circuit boards
Ceramic holes can provide electrical interconnect, mechanical location or a thermal path. State their purpose because each function creates different manufacturing and inspection requirements.
Read the guide07 / Design guidesCreepage, clearance and ceramic PCB insulation
Ceramic bulk dielectric strength does not determine safe working voltage for a finished circuit. Insulation design also depends on geometry, interfaces, environment and the applicable product standard.
Read the guide08 / Design guidesRF impedance design on ceramic substrates
Controlled impedance on ceramic depends on dielectric properties, conductor geometry and the surrounding package. Use frequency-appropriate data and validate the actual interconnect structure.
Read the guide09 / Design guidesCTE mismatch in ceramic PCB assemblies
Thermal expansion mismatch creates differential movement between ceramic, copper, devices and housings. That movement becomes stress only through the constraints and compliance of the assembled structure.
Read the guide10 / Design guidesMounting and handling ceramic circuit boards
Ceramic substrates are stiff and brittle. Design supports, fixtures and fastening loads so the circuit is not forced to accommodate bending or concentrated edge impacts.
Read the guide11 / Design guidesCeramic PCB panelization and usable yield
Panelization balances part count with process margins, cutting lanes, support and assembly access. The geometric maximum is not necessarily the most economical manufacturable panel.
Read the guide12 / Design guidesCeramic PCB assembly design tips
Ceramic PCB assembly requires a matched finish, attachment material, thermal profile and mechanical support. Reusing an FR-4 assembly recipe without review can create avoidable defects.
Read the guide13 / Design guidesWire bonding on ceramic circuit boards
Reliable wire bonding depends on pad metallurgy, cleanliness, support and a qualified bonding process. A generic gold-colored surface is not a wire-bond specification.
Read the guide14 / Design guidesDie attachment to ceramic substrates
Die attach forms both a thermal and mechanical interface. Choose solder, sintered metal or adhesive with the die backside, substrate finish and service conditions in view.
Read the guide15 / Design guidesSolder mask and protective layers on ceramic PCBs
A ceramic circuit does not automatically need conventional solder mask. Add a protective layer only when its electrical, assembly or environmental function is defined and its process is compatible.
Read the guide16 / Design guidesCeramic PCB DFM checklist
A useful ceramic PCB manufacturability review checks the exact material, process, drawing, assembly method and acceptance tests. Resolve conflicting requirements before requesting production pricing.
Read the guide17 / Design guidesThermal cycling and ceramic substrate reliability
Thermal cycling evaluates how an assembly responds to repeated temperature changes. Meaningful comparisons require the same construction, test conditions and failure criteria.
Read the guide18 / Design guidesCeramic PCB failure analysis: find the origin
A cracked ceramic, lifted conductor or electrical failure is an observation, not a root cause. Preserve evidence and trace the failure to a material, design, assembly or service mechanism.
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