Product formats
Find the construction your project needs.
Explore ceramic circuit configurations and the information needed to specify them. These are engineering product guides; availability, dimensions and production capability require project review.

Single-sided ceramic PCBs
A single-sided ceramic circuit places its functional conductor pattern on one face. It can suit simple sensors, heaters, hybrids and light-source carriers when routing and attachment permit.
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Double-sided ceramic PCBs
Double-sided ceramic circuits use metal on both faces for electrical routing, thermal attachment or both. Connections between faces must be specified as part of the chosen manufacturing process.
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Multilayer ceramic PCBs and interconnects
Multilayer ceramic circuits integrate routing across several conductor levels. LTCC and HTCC are common co-fired approaches, while other builds require a specifically qualified dielectric and metallization system.
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Ceramic power substrates
Ceramic power substrates combine electrically isolated circuits with a heat path from semiconductor devices to the cooling assembly. DBC and AMB are important construction families.
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Ceramic LED circuit boards
Ceramic LED boards provide electrical routing and a thermal path beneath light-emitting devices. The design must also account for optical surfaces, attachment and package geometry.
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RF and microwave ceramic substrates
RF ceramic circuit carriers use controlled dielectric and conductor structures to route signals, connect devices and integrate package functions. Material data must match the operating frequency.
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Ceramic laser diode submounts
Laser submounts must transfer concentrated heat while maintaining attachment quality and positional stability. AlN and other specialized thermal constructions are evaluated at the package level.
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Ceramic hybrid circuits
Hybrid circuits combine printed or deposited functions with attached components on a ceramic carrier. Thick-film and thin-film approaches offer different routes to integration and precision.
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Ceramic heater circuits
Ceramic heaters use resistive patterns and a substrate to create a controlled temperature field. Material selection can aim to spread heat or confine it, depending on the application.
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Hermetic ceramic electronic packages
A hermetic ceramic package combines a ceramic body, electrical feedthroughs and a sealing system. The completed package, rather than the bare substrate, must meet the specified leak and environmental requirements.
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