CERAMIC CIRCUITS · MATERIALS TO MANUFACTURINGJudy@4PCBA.com
Two white ceramic circuit boards with patterned conductors and circular pads
01 / Product formats

Single-sided ceramic PCBs

A single-sided ceramic circuit places its functional conductor pattern on one face. It can suit simple sensors, heaters, hybrids and light-source carriers when routing and attachment permit.

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Ceramic panel with four patterned circuit areas and curved conductor paths
02 / Product formats

Double-sided ceramic PCBs

Double-sided ceramic circuits use metal on both faces for electrical routing, thermal attachment or both. Connections between faces must be specified as part of the chosen manufacturing process.

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Ceramic circuit carrier with repeated rectangular gold-colored pads
03 / Product formats

Multilayer ceramic PCBs and interconnects

Multilayer ceramic circuits integrate routing across several conductor levels. LTCC and HTCC are common co-fired approaches, while other builds require a specifically qualified dielectric and metallization system.

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Four ceramic circuit carriers with patterned gold-colored and silver-colored metallization
04 / Product formats

Ceramic power substrates

Ceramic power substrates combine electrically isolated circuits with a heat path from semiconductor devices to the cooling assembly. DBC and AMB are important construction families.

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Octagonal ceramic circuit with repeated small pads and labeled component positions
05 / Product formats

Ceramic LED circuit boards

Ceramic LED boards provide electrical routing and a thermal path beneath light-emitting devices. The design must also account for optical surfaces, attachment and package geometry.

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Ceramic sample carrying closely spaced parallel gold-colored conductor lines
06 / Product formats

RF and microwave ceramic substrates

RF ceramic circuit carriers use controlled dielectric and conductor structures to route signals, connect devices and integrate package functions. Material data must match the operating frequency.

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Ceramic circuit panels with gold-colored bond pads and through-holes
07 / Product formats

Ceramic laser diode submounts

Laser submounts must transfer concentrated heat while maintaining attachment quality and positional stability. AlN and other specialized thermal constructions are evaluated at the package level.

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Assembled white ceramic circuit carrying components and gold-colored tracks
08 / Product formats

Ceramic hybrid circuits

Hybrid circuits combine printed or deposited functions with attached components on a ceramic carrier. Thick-film and thin-film approaches offer different routes to integration and precision.

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Square ceramic circuit sample with a dense repeated conductor pattern
09 / Product formats

Ceramic heater circuits

Ceramic heaters use resistive patterns and a substrate to create a controlled temperature field. Material selection can aim to spread heat or confine it, depending on the application.

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Square ceramic package carrier with a central cavity and peripheral pads
10 / Product formats

Hermetic ceramic electronic packages

A hermetic ceramic package combines a ceramic body, electrical feedthroughs and a sealing system. The completed package, rather than the bare substrate, must meet the specified leak and environmental requirements.

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