Processes
Turn a substrate into a manufacturable circuit.
Compare bonded copper, plated copper, printed films and co-fired multilayers. Conductor geometry, surface finish and assembly requirements determine which route is practical.
DBC ceramic PCB: direct bonded copper
Direct bonded copper (DBC, also called DCB) joins copper to a ceramic substrate to form a power-circuit carrier. Ceramic choice and copper geometry must be specified together.
Read the guide02 / ProcessesDPC ceramic PCB: direct plated copper
DPC forms patterned plated copper on a prepared ceramic surface, typically using a deposited seed and adhesion system. It is a candidate for fine interconnects and metallized ceramic vias.
Read the guide03 / ProcessesAMB ceramic substrates: active metal brazing
Active metal brazing (AMB) joins copper and ceramic using a reactive braze system. It is widely associated with robust silicon nitride power substrates and also appears in other qualified material systems.
Read the guide04 / ProcessesThick-film ceramic PCB technology
Thick-film circuits are built by printing and firing compatible conductor, resistor and dielectric materials on ceramic. Their strengths include hybrid integration and functional printed elements.
Read the guide05 / ProcessesThin-film ceramic circuits
Thin-film processing deposits and patterns metal or resistive layers on a prepared substrate. It is useful for precise geometry, RF circuits and controlled resistor networks.
Read the guide06 / ProcessesLTCC multilayer ceramic PCB process
Low-temperature co-fired ceramic (LTCC) processing combines patterned unfired tapes into a fired multilayer structure with internal conductors and vias.
Read the guide07 / ProcessesHTCC ceramic packages and substrates
High-temperature co-fired ceramic (HTCC) processing creates multilayer ceramic structures with compatible refractory-metal conductors, often for robust electronic packages.
Read the guide08 / ProcessesLaser machining and singulation of ceramic PCBs
Laser cutting, scribing and hole formation shape ceramic substrates, but edge quality and dimensional capability depend on material, thickness and the qualified process.
Read the guide09 / ProcessesSurface finishes for ceramic circuit boards
Choose a ceramic circuit’s surface finish for the attachment process and environment. Solderability, wire bonding and die attachment can require different pad metallurgies.
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