Materials
Choose the ceramic before you choose the circuit.
Explore mainstream electronic ceramics, co-fired systems and specialty substrates. Compare properties at the grade level, then match the material to a manufacturing route.
| Ceramic / named example | Thermal conductivity | Bare-ceramic CTE | Selection focus |
|---|---|---|---|
| Aluminacuramik Power | 24 W/m·K | 6.8 ppm/K | Cost-conscious thermal isolation |
| Aluminum nitridecuramik Thermal | 170 W/m·K | 4.8 ppm/K | Low substrate thermal resistance |
| Silicon nitridecuramik Performance | 90 W/m·K | 2.5 ppm/K | Mechanical and cycling robustness |
| Zirconia-toughened aluminacuramik Power Plus (HPS) | 26 W/m·K | 7.4 ppm/K | Toughened alumina power substrates |
| LTCC glass ceramicKyocera GL570 | 2.8 W/m·K | 3.4 ppm/K | Embedded RF routing and packaging |
Representative product values, not universal limits or a manufacturing offer. Rogers conductivity: 20°C; CTE: 20–300°C. Kyocera GL570 CTE: room temperature–400°C; conductivity as published. Copper-clad stack CTE differs from bare ceramic. Sources: Rogers data sheet; Kyocera LTCC data. Review data definitions and limitations.
Alumina PCB: aluminum oxide substrates
Alumina (Al₂O₃) is a practical starting point for ceramic circuits that need electrical isolation, dimensional stability and a useful thermal path at a controlled cost.
Read the guide02 / Materials96% alumina for ceramic circuits
96% alumina is widely associated with thick-film electronic substrates. Select it by the supplier’s grade and compatible paste system, not by purity alone.
Read the guide03 / Materials99.6% alumina: precision circuit substrates
High-purity alumina is a candidate for fine-film and precision electronic substrates, but the purchase specification must also control surface finish and dimensional quality.
Read the guide04 / MaterialsAluminum nitride PCB: AlN substrate guide
Aluminum nitride combines electrical insulation with high thermal conductivity. It is most valuable when resistance through the ceramic is a meaningful part of the total heat path.
Read the guide05 / MaterialsSilicon nitride PCB: Si₃N₄ power substrates
Silicon nitride is a strong candidate for ceramic power substrates exposed to demanding mechanical loads and repeated temperature changes, commonly with AMB copper.
Read the guide06 / MaterialsZTA: zirconia-toughened alumina substrates
Zirconia-toughened alumina combines an alumina-based substrate with a toughening phase. It is worth comparing when conventional alumina has insufficient mechanical margin.
Read the guide07 / MaterialsZirconia substrates for heaters and sensors
Zirconia (ZrO₂) is a specialty substrate for designs that may benefit from thermal isolation and particular mechanical or sensing properties. It is not the default heat-spreading ceramic.
Read the guide08 / MaterialsBeryllium oxide: specialist ceramic substrates
Beryllium oxide (BeO) is used in some specialized electronic packages. Its thermal performance must be considered together with the controls required for beryllium-containing material.
Read the guide09 / MaterialsLTCC glass ceramics: select a material system
LTCC uses a compatible glass-ceramic tape, conductor and firing system to form multilayer circuits. Its value often lies in integration and RF routing rather than heat spreading.
Read the guide10 / MaterialsSapphire substrates for precision electronics
Sapphire is single-crystal aluminum oxide. It is a specialty substrate for optical, thin-film and high-frequency applications, distinct from ordinary polycrystalline alumina circuit boards.
Read the guide11 / MaterialsGlass and quartz circuit substrates
Glass and quartz are specialty electronic substrate options. They should be specified by composition, structure and function instead of being grouped under a generic ceramic PCB specification.
Read the guide12 / MaterialsSilicon carbide: device material or circuit substrate?
Silicon carbide (SiC) can refer to the semiconductor die, a wafer or an engineered ceramic component. A SiC power module does not necessarily use SiC as its insulating circuit carrier.
Read the guide13 / MaterialsBoron nitride in electronic substrate design
Boron nitride spans bulk ceramics, fillers and thin crystalline layers used in specialized electronics. These forms are not interchangeable with a conventional copper-clad ceramic PCB.
Read the guide14 / MaterialsDiamond heat spreaders and ceramic circuits
Engineered diamond can serve as a specialty heat spreader in high-heat-flux packages. It belongs in a system-level thermal study, not in a list of interchangeable standard ceramic PCBs.
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