Specify the bonding system
State wire material, approximate wire size, pad construction and bonding method. The final surface and barrier layers must be compatible. Ask the assembler and substrate supplier to agree on the pad stack before releasing the artwork.
Provide access and support
Pads need tool clearance, bond placement tolerance and a suitable local surface. Loop geometry affects electrical and mechanical behavior. Support the ceramic under bonding loads without creating bending; keep fixtures clear of sensitive films and edges.
Test joints after relevant exposure
Initial pull or shear results are only part of qualification. Evaluate the effect of storage, cleaning, thermal exposure and the intended package environment. Define acceptance criteria and the location of failure so the result can distinguish wire, interface and substrate problems.
Engineering example
A mixed solder-and-wire-bond assembly may expose bond pads to flux residue before bonding. Review cleaning and process order rather than assuming the original finish remains bondable.
Before you release the design
- Name wire and pad materials.
- Provide tool access and local support.
- Qualify bond strength after relevant aging.
Sources and further technical reading
Manufacturer references support the material and process context. Worked examples and checklists are engineering guidance; they are not test results or supplier guarantees.