Post-fired circuit routes
A fired ceramic is prepared for bonded copper, brazed copper, plated metal or printed/deposited films. Patterning, finishing and singulation follow a process-specific sequence. The actual order depends on whether holes, edges or metal features need to be formed before another operation.
Co-fired multilayer routes
Unfired tapes receive vias and conductor patterns, then are stacked, laminated and fired as a compatible material set. The processor controls shrinkage and registration. External pads and package attachments may need additional finishing after firing.
Inspection belongs throughout the flow
Incoming material identity, geometry, metal adhesion, electrical continuity and final assembly requirements need appropriate checks. Define acceptance before production. A generic flowchart cannot replace the controlled traveler and process window for the actual material system.
Engineering example
A co-fired via is built into the tape stack, while a plated via in fired ceramic depends on hole preparation and metallization. Specifying the via method prevents incompatible artwork and inspection assumptions.
Before you release the design
- Identify post-fired or co-fired construction.
- Obtain the process-specific design rules.
- Agree on inspection at relevant stages.
Sources and further technical reading
Manufacturer references support the material and process context. Worked examples and checklists are engineering guidance; they are not test results or supplier guarantees.